Hard solder particularly for grey pig iron, cast steel, iron and the like



Patented Nov. 19, 1929 UNITED STATES PATENT OFFICE EMIL LAY AND CARLMATTICK,

F FRANKFORT-ON-THE-MAIN, GERMANY, ASSIGNORS TO AMERICAN LURGICORPORATION, OF NEW YORK, N. Y., A CORPORATION OF NEW YORK HARD SOLDIERPARTICULARLY FOR GREY PIG IRON, CAST STEEL, IRON AN D THE LIKE NoDrawing. Application filed February 15, 1928, Serial No. 254,610, and inGermany February 18, 1927.

- This invention relates to a hard solder particularly for grey pigiron, cast steel, iron and the like.

Repairs to, and additions to parts of cast iron have hitherto beeneffected by autogenous welding and it is only lately that the tendencyhas been to employ hard solders to a greater extent in view of thedanger which is encountered by setting up stresses due to welding.

As is well known wires of hard solder fuse at a temperature of about 3000., lower than rods of cast iron, so that when soldering the temperaturevariations within the workpiece are not so high as those occurringduring autogenous welding and consequently also such great stresses arenot set up. 1

The hitherto usual wires only partly fulfil the requirements demandedfrom such a hard solder. A hard solder wire for cast iron and the likemust melt smoothly and without liberating vapour, must be capable ofbeing applied without forming pores and must possess a hardness whichcorresponds to that of cast iron of the work-piece. .These requirementsare of particular importance when hard-soldering operations are to becarried out in a continuous manner.

A wire of the following composition has been found particularly suitableviz:

to 53% copper, 2 to 5% nickel, 0.2. to 1% silicon, remainder zinc.

The alloys of a composition within the above described limits have theadvantage that they can at the same time be easily pressed or extrudedso that wires can easily be producedtherefrom. 4

Claim: '1

Hard solder particularly for greypig. iron, cast steel, iron and thelike, comprising 42 to f copper, 1 to.10% nickel and an appreciableamount up to 3% silicon, the remainder consisting of zinc.

In testimony whereof we aflix our signatures. Y

DR. EMIL LAY.

-DR. CARL MATTICK.

It is known that the desired hardness can t be attained by alloyingnickel to brass alloys. However when added in larger amounts, nickelrenders the'material refractory and gives rise to the active liberationofzinc vapours so that the applied solder becomes porous. For thisreason nickel-brass alloys or German silver alloys cannot be employeddirectly.

It has now tage can be overcome amounts of up to 3%.

been found that this disadvanby alloying silicon in In many cases asilicon-content of 0.5% is suflicient. The addi tion ofsilicon rendersthe hard solder more fluid and the nickel renders it harder so that 7preferably any desired degree of. fluidity and toughness can be attainedby,suitably mutually adjusting the additions of nickel and silicon. A

A hard solder according tothe'invention comprises 42 to 60%- of copper,1 to 10% of nickel and up to 3% of silicon, the remainder consisting ofzinc.

